{"product_id":"2uul-bg02-ab-0-3-0-85-spacing-universal-bga-reballing-stencil","title":"2UUL BG02 AB 0.3-0.85 Spacing Universal BGA Reballing Stencil","description":"\u003cp\u003eThe 2UUL BG02 AB 0.3-0.85 Spacing Universal BGA Reballing Stencil is a tool designed for BGA chip reballing. It is suitable for mobile phone motherboard repair and improves repair efficiency by supporting multiple BGA ball pitches.\u003c\/p\u003e \n\u003cul\u003e\n\u003cli\u003eProduct Type: BGA Stencils\u003c\/li\u003e\n\u003cli\u003eCompatibility: Universal BGA chips\u003c\/li\u003e\n\u003cli\u003eMaterial: Stainless steel\u003c\/li\u003e\n\u003cli\u003eKey Feature: Laser-cut precision\u003c\/li\u003e\n\u003cli\u003eColor\/Variant: Silver\u003c\/li\u003e\n\u003cli\u003eIntended Use: Mobile phone motherboard repair\u003c\/li\u003e\n\u003cli\u003eBall Pitch Range: 0.3mm to 0.85mm\u003c\/li\u003e\n\u003cli\u003eLayout: AB universal layout\u003c\/li\u003e\n\u003cli\u003eManufacturing Technology: Advanced laser cutting technology\u003c\/li\u003e\n\u003cli\u003eSurface Finish: Polished surface to prevent solder ball sticking\u003c\/li\u003e\n\u003cli\u003eApplications: Mobile phone motherboard repair, IC chip rework, PCB maintenance, electronics repair\u003c\/li\u003e\n\u003cli\u003eDurability: Excellent heat resistance and long-term use without deformation\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"2UUL","offers":[{"title":"Default Title","offer_id":45524857487546,"sku":"EDA0089204","price":249.0,"currency_code":"ZAR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0569\/2761\/7210\/files\/EDA0089204.jpg?v=1768902918","url":"https:\/\/gr.pmcjewellery.com\/products\/2uul-bg02-ab-0-3-0-85-spacing-universal-bga-reballing-stencil","provider":"PMC TechLife","version":"1.0","type":"link"}