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2UUL BG02 AB 0.3-0.85 Spacing Universal BGA Reballing Stencil

SKU: EDA0089204
Sale Sold out Pre-order
Regular price R 249.00
Regular price Sale price R 249.00
Pay in 3, 6, or 12 monthly instalments with

Import Taxes & Duties Included

6-13 business days

In Stock CHN

Processing time: 1-3 days

Description

The 2UUL BG02 AB 0.3-0.85 Spacing Universal BGA Reballing Stencil is a tool designed for BGA chip reballing. It is suitable for mobile phone motherboard repair and improves repair efficiency by supporting multiple BGA ball pitches.

  • Product Type: BGA Stencils
  • Compatibility: Universal BGA chips
  • Material: Stainless steel
  • Key Feature: Laser-cut precision
  • Color/Variant: Silver
  • Intended Use: Mobile phone motherboard repair
  • Ball Pitch Range: 0.3mm to 0.85mm
  • Layout: AB universal layout
  • Manufacturing Technology: Advanced laser cutting technology
  • Surface Finish: Polished surface to prevent solder ball sticking
  • Applications: Mobile phone motherboard repair, IC chip rework, PCB maintenance, electronics repair
  • Durability: Excellent heat resistance and long-term use without deformation

Questions about features, compatibility, or warranty? Chat with our local support team!