i2C T18 LCD Display PCB Motherboard Layered Desoldering Station For iPhone X-15 Pro Max with Glue Removal Module, US Plug
i2C T18 LCD Display PCB Motherboard Layered Desoldering Station For iPhone X-15 Pro Max with Glue Removal Module, US Plug
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No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R634.16/mo 3 months
- R320.67/mo 6 months
- R169.24/mo 12 months
- From R634.16/month over 3 months, or as low as R169.24/month over 12. Total repayable over 12 months: R2030.88. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
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Description
The i2C T18 LCD Display PCB Motherboard Layered Desoldering Station is a repair platform designed for motherboard separation and bonding. It is suitable for use with iPhone X-15 Pro Max models, providing efficient chip CPU glue removal and desoldering capabilities.
- Product Type: Repair Platform
- Compatibility: iPhone X-15 Pro Max
- Material: Aviation aluminum
- Color/Variant: N/A
- Intended Use: Motherboard separation and bonding
- Minimum Temperature: 180°C
- Maximum Temperature: 245°C
- Body Size: 13.4 x 11.6 x 1.7 cm
- Display: LED digital display
- Temperature Adjustment: 2 Gears
- Heating Technology: PTC ceramic heating pieces
- Heating Time: Heats up to 180°C in 60 seconds
- Magnetic Modular Design: Strong magnetic automatic adsorption for module replacement
- Precision Processing: CNC precision processing, high-temperature resistance, oxidation resistance
- Scope of Use: Suitable for 98% of chips for glue removal and desoldering
- Additional Features: Supports double-layer motherboard layering and repair of various precision electronic and digital products
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