Qianli iSocket Motherboard Layered Test Fixture For iPhone 13 Series
Qianli iSocket Motherboard Layered Test Fixture For iPhone 13 Series
Spread the cost
No lump sum. No stress. Pick a repayment term that works for your budget — and keep your cash flow intact.
- R1736.75/mo 3 months
- R878.2/mo 6 months
- R463.48/mo 12 months
- From R1736.75/month over 3 months, or as low as R463.48/month over 12. Total repayable over 12 months: R5561.76. Interest at 20.75% p.a. applies.
- Quick online application — most people get a decision within minutes. Your first payment only kicks in 30 days after you buy.
- Mobicred is a registered South African credit provider (NCR reg. NCRCP7852). Available to SA residents aged 18+ with a valid ID and bank account.
At checkout, simply select Mobicred as your payment method.
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Mobicred is a revolving credit facility provided by Retail Capital (Pty) Ltd, a registered credit provider (NCR reg. NCRCP7852) in terms of the National Credit Act 34 of 2005. Credit is subject to approval and an affordability assessment. Interest rate: 20.75% p.a. compounded monthly (1.7292%/month). Available to South African residents aged 18 and older. Full terms & conditions apply.
Import Taxes & Duties Excluded
6-13 business days
In Stock CHN
Processing time: 1-3 days
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Description
The Qianli iSocket Motherboard Layered Test Fixture is a repair fixture designed for testing iPhone 13 series motherboards. It simplifies the testing process for maintenance personnel by allowing layered motherboard testing, thus saving time and reducing complexity.
- Product Type: Repair Fixture
- Compatibility: iPhone 13, iPhone 13 Pro, iPhone 13 Pro Max, iPhone 13 mini
- Material: Beryllium copper, CNC processed components
- Key Feature: Layered testing design
- Dimensions: Compact and lightweight design
- Operation: Simple and fast operation, easy to use
- Design: Middle frame included, no need for spacers
- Testing Method: RF motherboard, pin board, and logic motherboard are laminated and stacked on the test frame base
- Probe: Double-headed probe for accurate alignment and improved contact performance
- Stability: Fixed buckle prevents motherboard warping, ensuring accurate test data
- Manufacturing: High-precision CNC machine tool processing
- Conductivity: High-quality beryllium copper spring probe for good conductivity
- Performance: Overload stability, small deviation of detection value
- Durability: High hardness materials, resistant to deformation, maximizes service life
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